The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2020

Filed:

Sep. 05, 2017
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Ruediger Butterbach, Essen, DE;

Patrick Markiefka, Duesseldorf, DE;

Carsten Schubert, Duesseldorf, DE;

Judith Siepenkothen, Ratingen, DE;

Siegfried Kopannia, Krefeld, DE;

Assignee:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 11/04 (2006.01); C09J 11/04 (2006.01); C09K 5/14 (2006.01);
U.S. Cl.
CPC ...
C09J 11/04 (2013.01); C09K 5/14 (2013.01);
Abstract

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.


Find Patent Forward Citations

Butterbach, Ruediger. (2020). Thermally conductive adhesive (U.S. Patent No. 10689551). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10689551

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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