Company Filing History:
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Years Active: 2019-2020
Title: Innovator Spotlight: Patrick Markiefka – Advancing Adhesive Technologies
Introduction
Patrick Markiefka, an inventive mind based in Düsseldorf, Germany, has made significant contributions to the field of adhesive technology. With a portfolio of 2 patents, Patrick has focused on developing innovative adhesive compositions that enhance thermal conductivity and adhesion properties for various applications.
Latest Patents
Patrick's latest patent is centered around thermally conductive adhesives. This invention pertains to hot-melt adhesives engineered for improved thermal conductivity, incorporating a unique combination of (co)polymer binders and fillers. These compositions contribute to the creation of articles with enhanced thermal properties, facilitating advancements in various industrial applications.
Additionally, he has developed a foamable hot melt adhesive composition. This invention addresses the need for reliable adhesion in packaging applications, emphasizing high heat resistance. His foamable hot melt adhesive not only offers strong adhesion but also presents an environmentally and economically viable option for manufacturers aiming to improve their packaging solutions.
Career Highlights
Throughout his career, Patrick has worked with prominent companies such as Henkel AG & Company and Henkel IP & Holding GmbH. His experience in these leadership roles has enabled him to advance adhesive technology while contributing to the innovative spirit of these organizations.
Collaborations
Patrick has had the opportunity to collaborate with talented professionals like Ruediger Butterbach and Carsten Schubert. These collaborations have fostered an environment of creativity and problem-solving, enhancing the development of next-generation adhesive products.
Conclusion
Patrick Markiefka exemplifies the spirit of innovation within the adhesive industry. His dedication to developing cutting-edge adhesive technologies positions him as a key inventor, paving the way for new possibilities in adhesion solutions. With his ongoing contributions, the future of adhesive applications looks promising.