Henkel Kommanditgesellschaft Auf Aktien

Henkel Ag & Company, Kgaa

Siegfried Kopannia

Ruediger Butterbach

Ulrike Maassen

Reimar Heucher

Judith Siepenkothen

Carsten Schubert

Thomas Moeller

Juergen Wichelhaus

Marcus Heemann

Angela Rossini

Johannes Andres

Luca Mario Marchese

Bettina Becker

Tina Nataniel

Fabio Angelo Spada

Thomas Möller

Carsten Friese

Katja Klophaus

Alasdair Crawford

Kurt Schueller

Patrick Markiefka

Jean Louis Requin

Dirk Bonke

Ulricke Maassen

Dieter Dausmann

Rudiger Butterbach

Rüdiger Butterbach

Rainer SCHÖNFELD

Fabio Ticozzelli

Heinrich Dwight

The present invention relates to hotmelt adhesives with improved thermal conductivity, uses thereof and methods for the manufacture of articles with improved thermal conductivity using said adhesive compositions. The adhesive compositions of the invention comprise at least one (co)polymer binder and combination of different fillers, as defined herein.

Thermally conductive adhesive

The present invention relates to a method for reversibly bonding a first and a second substrate, wherein at least the first substrate is an electrically non-conductive substrate, the method comprising: coating the surface of the electrically non-conductive substrate(s) with a conductive ink; applying an electrically debondable hot melt adhesive composition to the conductive ink-coated surface of the first substrate and/or the second substrate; contacting the first and the second substrates such that the electrically debondable hot melt adhesive composition is interposed between the two substrates; allowing formation of an adhesive bond between the two substrates to provide bonded substrates; and optionally applying a voltage to the bonded substrates whereby adhesion at least one interface between the electrically debondable hot melt adhesive composition and a substrate surface is substantially weakened. Furthermore, the present invention relates to the bonded substrates thus obtained.

Electrical debonding of PU hot melt adhesives by use of conductive inks

A reactive hotmelt adhesive comprising two components A and B each containing one or more polymers A or B having different functional groups, these groups being able to react with one another under the influence of temperature, and i) the mutually reactive functional groups are selected from hydroxyl, amine, carboxylic acid, anhydride and epoxide groups, ii) unreactive polymers and/or additives are present in at least one of the components, iii) the components are present in spatially separate regions, the adhesive having a first temperature range between 80 and 150&#xb0; C. in which the components melt and are miscible with one another without reaction of the functional groups with one another, and the adhesive having a second temperature range between 130 and 190&#xb0; C. in which it can melt and chemically crosslink, the second temperature being above the first temperature.

Reactive two-component hotmelt adhesive composition

Composite materials contain fibers from natural sources and polyamides, wherein the polyamides have a softening point below 220&#xb0; C., and a heat deflection temperature above 50&#xb0; C. The polyamides consist of a) 30 to 70 mol % dimeric fatty acids, b) 30 to 70 mol % aliphatic dicarboxylic acids, c) 70 to 98 mol % aliphatic diamines, d) up to 25 mol % cycloaliphatic diamines e) up to 20 mol % polyether diamines, wherein aliphatic dicarboxylic acids are selected from linear, non-branched C10 to C18 dicarboxylic acids, and wherein the weighted average number of C-atoms is between 11.5 to 14.5, and the sum of mol % for acids and amine each add to 100.

Composite material containing natural fibers

Water-swellable hot-melt adhesives based on a tackifying resin, a water-dispersible EVA wax, an ethylene/acrylic ester copolymer, a water-soluble homo- or co-polymer and a super absorber polymer powder having an average particle size of less than 80 &mgr;m display a clearly improved swelling behavior in comparison with the prior art. Furthermore, the swelling agent is significantly more homogeneously distributed in the matrix. Such hot-melt adhesives are suitable for ensuring longitudinal water impermeability in modern cable structures, as water-swellable jointing compounds in the building industry in the area of building conservation and restoration. Such hot-melt adhesives are further suitable for the manufacture of absorbent textile fabrics in the personal hygiene sector.

Water-swellable hot-melt-type adhesive

The present invention relates to a process for preparing a digital versatile disc. The process of the present invention includes providing a hot melt adhesive containing at least one thermoplastic elastomer, at least one hydrocarbon resin, at least one poly-&agr;-olefin, and at least one polar wax, and providing at least two disc blanks. The hot melt adhesive is applied directly or indirectly to at least one of the blanks and the blanks are bonded together using the hot melt adhesive. The present invention also provides a digital versatile disc containing the hot melt adhesive.

Hot-melt adhesive for glueing DVDs

Thermoplastic compositions based on a water-insoluble component of one or more thermoplastic copolymers and one or more resins with a saponification number and a water-soluble or water-dispersible component and a water-swellable component from the class of superabsorbers are suitable as water-swellable hotmelt adhesives. Such water-swellable hotmelt adhesives are preferably used for the production of watertight constructions, more particularly for the production of longitudinally watertight cable constructions.

Swellable hotmelt adhesive

Hotmelt adhesives with a melt viscosity of >100,000 mPas at 160&deg; C. are suitable for bonding substrate halves in the production of digital versatile discs (DVDs) and afford major process-related advantages over known UV-curing adhesives. In their pigmented embodiment, they are able to combine the three functions of adhesive bonding, protecting the metallic reflection layer against corrosion and forming a covering background for a text/graphics layer.

Hot-melt adhesive for gluing digital versatile discs

A composition of matter useful as a hotmelt adhesive is provided. The composition is comprised of a polyamide based on dimerized fatty acid and having an amine value higher by at least two units than the acid value of said polyamide and a filler comprised of a carbonate. The filler is preferably comprised of fine particles of calcium carbonate. The adhesive is particularly useful for bonding metals, e.g. to plastics and the bonding of cables with multilayer sheaths, e.g. in optical cables and power cables.

Polyamide hotmelt adhesive

Hotmelt adhesive

Thermoplastic hotmelt adhesive

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Krefeld, Germany

Siegfried Kopannia