Boise, ID, United States of America

Shyam Ramalingam

This inventor holds 11 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Micron Technology Incorporated, Intel Corporation, Sony Semiconductor Solutions Corporation. Active years: 2015-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shyam Ramalingam. Retrieved from https://idiyas.com/inventor/shyam-ramalingam

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.8

ph-index = 3

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 2015-2021

Loading Chart...
Loading Chart...
11 patents (USPTO):Explore Patents

Title: Innovations of Shyam Ramalingam

Introduction

Shyam Ramalingam is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor devices, holding a total of 11 patents. His work focuses on enhancing the performance and reliability of electronic components through innovative materials and designs.

Latest Patents

Among his latest patents, Shyam has developed conductive interconnect structures that incorporate negative thermal expansion materials. This invention addresses the challenges posed by thermal expansion in semiconductor devices. In one embodiment, a semiconductor device includes a substrate with an opening that is partially filled with a conductive material, such as copper, and a negative thermal expansion (NTE) material, like zirconium tungstate. This combination aims to improve the stability and performance of semiconductor devices.

Another significant patent involves interconnect assemblies with through-silicon vias and stress-relief features. This design allows for better accommodation of thermal expansion and contraction, thereby managing internal stresses within the semiconductor device. The manufacturing methods outlined in this patent include techniques for creating stress-relief gaps in the conductive interconnect.

Career Highlights

Shyam Ramalingam has worked with prominent companies in the technology sector, including Micron Technology Incorporated and Intel Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Shyam has collaborated with talented individuals in his field, including Hongqi Li and Jin Lu. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Shyam Ramalingam's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a leading inventor in the industry. His work continues to influence the development of advanced electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…