Shun Hu

Title: Shun Hu: Innovator in Semiconductor Technology

Introduction

Shun Hu is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods for bonding semiconductor structures, which are crucial for the advancement of electronic devices.

Latest Patents

Shun Hu's latest patents include groundbreaking methods for bonding alignment marks at bonding interfaces. One of his notable inventions describes a method for forming a semiconductor device that involves creating a first device layer on a first substrate. A first bonding layer, which includes a first bonding contact and a first bonding alignment mark, is formed above this layer. A second device layer is then created on a second substrate, accompanied by a second bonding layer that includes a second bonding contact and a second bonding alignment mark. The alignment of these bonding marks ensures that the bonding contacts are precisely aligned when the substrates are bonded together, enhancing the reliability and performance of semiconductor devices.

Career Highlights

Throughout his career, Shun Hu has worked with leading companies in the semiconductor industry. He has been associated with Yangtze Memory Technologies Co., Ltd. and Wuhan Guoce Science & Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative approaches to semiconductor fabrication.

Collaborations

Shun Hu has collaborated with several talented individuals in his field, including Meng Yan and Jia Wen Wang. These collaborations have contributed to the successful development of his patented technologies.

Conclusion

Shun Hu is a key figure in the semiconductor industry, with a focus on innovative bonding methods that enhance device performance. His contributions through patents and collaborations continue to shape the future of semiconductor technology.