This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2003-2005.
Location History:
- Miadi, TW (2003)
- Miado, TW (2005)
Company Filing History:
Years Active: 2003-2005
Title: Innovations by Shu E Ku
Introduction
Shu E Ku is a notable inventor based in Miado, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in improving the adhesion strength of copper layers in manufacturing processes. With a total of 2 patents to his name, his work has garnered attention in the industry.
Latest Patents
One of Shu E Ku's latest patents focuses on a thin interface layer designed to improve copper etch stop. This invention addresses the common issue of poor adhesion between conventional etch stop layers, such as dichlorosilane or SiOC, and underlying copper layers. The method involves pre-heating the copper layer, followed by a pre-cleaning treatment with ammonia and nitrogen. This process is then complemented by forming an adhesive enhanced layer over the copper using alkyl-silane treatments. This innovative approach enhances the molecular binding between interfacing layers, leading to improved performance in semiconductor applications.
Career Highlights
Shu E Ku is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he applies his expertise in semiconductor manufacturing. His work has been instrumental in advancing technologies that are critical to the industry.
Collaborations
Shu E Ku has collaborated with notable colleagues, including Bi-Trong Chen and Lain-Jong Li. These partnerships have contributed to the development of innovative solutions in semiconductor technology.
Conclusion
Shu E Ku's contributions to the field of semiconductor technology, particularly through his patents, highlight his role as an influential inventor. His innovative methods for improving adhesion in copper layers are paving the way for advancements in manufacturing processes.