Shu-Chiao Kuo

Title: Innovations by Shu-Chiao Kuo in Semiconductor Technology

Introduction

Shu-Chiao Kuo is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the bonding structures used in semiconductor packages, which are crucial for the performance and reliability of electronic devices.

Latest Patents

Kuo's latest patents include a "Bonding structure for semiconductor package and method of manufacturing the same." This patent describes a method that involves providing a substrate with bonding pads and a semiconductor element with pillars. The innovative aspect lies in the sloped surfaces of the bonding pads and pillars, which improve the bonding process. Another patent, titled "Sloped bonding structure for semiconductor package," outlines a bonding structure where each bonding pad has a sloped surface, allowing for effective bonding with the semiconductor pillars while maintaining a gap that enhances performance.

Career Highlights

Shu-Chiao Kuo is currently employed at Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His work has been instrumental in developing advanced packaging solutions that meet the growing demands of modern electronics.

Collaborations

Kuo has collaborated with several talented individuals in his field, including Min-Fong Shu and Yi-Hsiu Tseng. These collaborations have contributed to the innovative advancements in semiconductor technology.

Conclusion

Shu-Chiao Kuo's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of more efficient and reliable electronic devices.