The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2016
Filed:
Feb. 13, 2015
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventors:
Min-Fong Shu, Kaohsiung, TW;
Yi-Hsiu Tseng, Kaohsiung, TW;
Kuan-Neng Chen, Kaohsiung, TW;
Shu-Chiao Kuo, Kaohsiung, TW;
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaosiung, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/49 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 23/3142 (2013.01); H01L 23/49838 (2013.01); H01L 24/81 (2013.01); H01L 2224/1607 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/1515 (2013.01); H01L 2924/20103 (2013.01); H01L 2924/20104 (2013.01); H01L 2924/20105 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/384 (2013.01);
Abstract
A bonding structure includes a substrate having a top surface and including at least one bonding pad. Each bonding pad is disposed adjacent to the top surface of the substrate and has a sloped surface. A semiconductor element includes at least one pillar. Each pillar is bonded to a portion of the sloped surface of a corresponding bonding pad, and a gap is formed between a sidewall of the pillar and the sloped surface of the corresponding bonding pad.