Min-Fong Shu

Title: Min-Fong Shu: Innovator in Semiconductor Technology

Introduction

Min-Fong Shu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative bonding structures that enhance the manufacturing processes of semiconductor packages.

Latest Patents

Min-Fong Shu's latest patents include a "Bonding structure for semiconductor package and method of manufacturing the same." This patent describes a method that involves providing a substrate with a top surface and bonding pads, where at least one bonding pad has a sloped surface. The method also includes bonding a semiconductor element with pillars to the bonding pads. Another notable patent is the "Sloped bonding structure for semiconductor package," which outlines a bonding structure that features a substrate with sloped bonding pads and pillars that create a gap between their sidewalls and the bonding pads.

Career Highlights

Min-Fong Shu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His expertise in this area has positioned him as a key player in the industry.

Collaborations

Throughout his career, Min-Fong Shu has collaborated with talented individuals such as Yi-Hsiu Tseng and Kuan-Neng Chen. These collaborations have further enriched his work and contributed to advancements in semiconductor technology.

Conclusion

Min-Fong Shu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor manufacturing.