Yi-Hsiu Tseng

Title: Yi-Hsiu Tseng: Innovator in Semiconductor Technology

Introduction

Yi-Hsiu Tseng is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in bonding structures for semiconductor packages. His innovative approaches have led to the development of multiple patents that enhance manufacturing processes in this critical industry.

Latest Patents

Yi-Hsiu Tseng holds 2 patents that showcase his expertise in semiconductor packaging. His latest patents include:

1. **Bonding structure for semiconductor package and method of manufacturing the same** - This patent describes a method of manufacturing a bonding structure that involves providing a substrate with bonding pads and a semiconductor element with pillars. The method emphasizes the importance of the slopes of the surfaces for effective bonding.

2. **Sloped bonding structure for semiconductor package** - This patent outlines a bonding structure that includes a substrate with sloped bonding pads and semiconductor pillars. The design allows for a gap between the pillar's sidewall and the bonding pad, optimizing the bonding process.

Career Highlights

Yi-Hsiu Tseng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.

Collaborations

Throughout his career, Yi-Hsiu Tseng has collaborated with notable colleagues, including Min-Fong Shu and Kuan-Neng Chen. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Yi-Hsiu Tseng's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the industry and pave the way for future advancements.