Chandler, AZ, United States of America

Shripad Gokhale

USPTO Granted Patents = 9 

Average Co-Inventor Count = 6.6

ph-index = 2

Forward Citations = 13(Granted Patents)


Location History:

  • Chandler, AZ (US) (2010 - 2013)
  • Gilbert, AZ (US) (2016)

Company Filing History:


Years Active: 2010-2025

where 'Filed Patents' based on already Granted Patents

9 patents (USPTO):

Title: Innovations of Shripad Gokhale

Introduction

Shripad Gokhale is a prominent inventor based in Chandler, AZ, known for his significant contributions to the field of microelectronics. With a total of nine patents to his name, Gokhale has made remarkable advancements in electronic packaging technologies.

Latest Patents

Among his latest patents is a microelectronics package that features a package-on-package (PoP) architecture utilizing inkjet barrier material to control bondline thickness. This innovative design includes a first package with a substrate, a die, a mold layer, and through mold interconnects (TMIs). Additionally, the electronic package comprises a second package that is electrically coupled to the first package, enhancing its functionality. Another notable patent involves laser ablation-based surface property modification and contamination removal, which also focuses on electronic packages. This patent describes an electronic package with a mold layer and an embedded die, showcasing Gokhale's expertise in improving electronic device performance.

Career Highlights

Gokhale's career is marked by his role at Intel Corporation, where he has been instrumental in developing cutting-edge technologies in microelectronics. His work has not only contributed to the advancement of electronic packaging but has also positioned him as a key figure in the industry.

Collaborations

Throughout his career, Gokhale has collaborated with notable colleagues, including Robert M. Nickerson and Purushotham Kaushik Muthur Srinath. These collaborations have further enriched his work and expanded the impact of his innovations.

Conclusion

Shripad Gokhale's contributions to microelectronics through his patents and work at Intel Corporation highlight his significant role in advancing technology. His innovative approaches continue to shape the future of electronic packaging.

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