Shripad Gokhale

This inventor holds 10 USPTO granted patents and 9 published patent applications and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2010-2026.

USPTO Granted Patents = 10 (Patent Applications = 9)

% Patents Active = 60.0

EPO Patents = 1 (Patent Applications = 2)

Average Co-Inventor Count = 6.2

ph-index = 2

Forward Citations = 13(Granted Patents)

Location History:

Chandler, AZ (US) (2010 - 2013)
Gilbert, AZ (US) (2016)

Company Filing History:

10 out of 56,240

Intel Corporation

patents

Years Active: 2010-2026

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10 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12616026 - Permanent layer for bump chip attach (2026-04-28),

2. 12417958 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone (2025-09-16),

3. 12394773 - Laser ablation-based surface property modification and contamination removal (2025-08-19),

4. 12362340 - Laser ablation-based surface property modification and contamination removal (2025-07-15),

5. 12347743 - Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone (2025-07-01),

6. 12315777 - Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone (2025-05-27),

7. 9508610 - Inline measurement of molding material thickness using terahertz reflectance (2016-11-29),

8. 8362627 - Reducing underfill keep out zone on substrate used in electronic device processing (2013-01-29),

9. 7875503 - Reducing underfill keep out zone on substrate used in electronic device processing (2011-01-25),

10. 7687890 - Controlling substrate surface properties via colloidal coatings (2010-03-30),

Title: Innovations of Shripad Gokhale

Introduction

Shripad Gokhale is a prominent inventor based in Chandler, AZ, known for his significant contributions to the field of microelectronics. With a total of nine patents to his name, Gokhale has made remarkable advancements in electronic packaging technologies.

Latest Patents

Among his latest patents is a microelectronics package that features a package-on-package (PoP) architecture utilizing inkjet barrier material to control bondline thickness. This innovative design includes a first package with a substrate, a die, a mold layer, and through mold interconnects (TMIs). Additionally, the electronic package comprises a second package that is electrically coupled to the first package, enhancing its functionality. Another notable patent involves laser ablation-based surface property modification and contamination removal, which also focuses on electronic packages. This patent describes an electronic package with a mold layer and an embedded die, showcasing Gokhale's expertise in improving electronic device performance.

Career Highlights

Gokhale's career is marked by his role at Intel Corporation, where he has been instrumental in developing cutting-edge technologies in microelectronics. His work has not only contributed to the advancement of electronic packaging but has also positioned him as a key figure in the industry.

Collaborations

Throughout his career, Gokhale has collaborated with notable colleagues, including Robert M. Nickerson and Purushotham Kaushik Muthur Srinath. These collaborations have further enriched his work and expanded the impact of his innovations.

Conclusion

Shripad Gokhale's contributions to microelectronics through his patents and work at Intel Corporation highlight his significant role in advancing technology. His innovative approaches continue to shape the future of electronic packaging.