The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2013
Filed:
Dec. 20, 2010
Shripad Gokhale, Chandler, AZ (US);
Kathy Wei Yan, Chandler, AZ (US);
Bijay S. Saha, Chandler, AZ (US);
Samir Pandey, Phoenix, AZ (US);
Ngoc K. Dang, San Diego, CA (US);
Munehiro Toyama, Ibarakiken, JP;
Shripad Gokhale, Chandler, AZ (US);
Kathy Wei Yan, Chandler, AZ (US);
Bijay S. Saha, Chandler, AZ (US);
Samir Pandey, Phoenix, AZ (US);
Ngoc K. Dang, San Diego, CA (US);
Munehiro Toyama, Ibarakiken, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a die attach area, and forming a layer on the substrate outside of the die attach area. The layer may be formed from a fluoropolymer material. The method also includes coupling a die to the substrate in the die attach area, wherein a gap remains between the die and the die attach area. The method also includes placing an underfill material in the gap and adjacent to the layer on the substrate. Examples of fluoropolymer materials which may be used include polytetrafluoroethylene (PTFE) and perfluoroalkoxy polymer resin (PFA). Other embodiments are described and claimed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile