Bijay S Saha

Title:Inventor Bijay S Saha: Advancements in Electronic Device Processing

Introduction

Bijay S Saha is an accomplished inventor based in Chandler, AZ, known for his contributions to the field of electronic device processing. With three patents to his name, Saha has made significant strides in innovation that impact the technology landscape.

Latest Patents

One of Saha's latest patents focuses on "Reducing underfill keep out zone on substrate used in electronic device processing." This patent describes methods for fabricating electronic devices by providing a substrate with a die attach area and forming a layer with fluoropolymer material outside the die attach area. The innovative approach allows for effective coupling of the die to the substrate while maintaining a gap for underfill material, enhancing the overall functionality and reliability of electronic devices. Notable examples of the fluoropolymer materials mentioned include polytetrafluoroethylene (PTFE) and perfluoroalkoxy polymer resin (PFA), showcasing Saha's commitment to utilizing advanced materials in his inventions.

Career Highlights

Saha has established a notable career at Intel Corporation, where he has played a key role in the development of cutting-edge electronic devices. His innovative thinking and technical expertise have contributed greatly to various projects within the company, making him a valued member of the team.

Collaborations

Throughout his career, Bijay S Saha has collaborated with talented individuals such as Munehiro Toyama and Shripad Gokhale. These partnerships have enriched his work, leading to the creation of impactful inventions that enhance the tech industry's efficiency and performance.

Conclusion

Bijay S Saha’s contributions to electronic device processing illustrate the importance of innovation in technology. With multiple patents emphasizing advanced fabrication methods, his work continues to shape the industry, paving the way for more efficient electronic devices and systems in the future.