The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2008

Filed:

Dec. 28, 2005
Applicants:

Bijay S. Saha, Chandler, AZ (US);

Munehiro Toyama, Ibarakiken, JP;

Ehab A. Nasir, Mesa, AZ (US);

Omar J. Bchir, Chandler, AZ (US);

Charavana K. Gurumurthy, Gilbert, AZ (US);

Inventors:

Bijay S. Saha, Chandler, AZ (US);

Munehiro Toyama, Ibarakiken, JP;

Ehab A. Nasir, Mesa, AZ (US);

Omar J. Bchir, Chandler, AZ (US);

Charavana K. Gurumurthy, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method includes forming a coating on a land contact of a package substrate, the coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold. An apparatus includes a package substrate including a plurality of land contacts wherein each of the plurality of land contacts includes a coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold.


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