Intel Corporation

Shripad Gokhale

Robert M Nickerson

Purushotham Kaushik Muthur Srinath

Nisha Ananthakrishnan

Amram Eitan

Elizabeth Nofen

John Decker

Hsin-Yu Li

Yang Guo

Nick Ross

Munehiro Toyama

Bijay S Saha

Ngoc K Dang

Andrew V Mazur

Kathy Wei Yan

Denis Myasishchev

Samir Pandey

Deepak Goyal

Zhiyong Wang

Nirupama Chakrapani

Nilanjan Z Ghosh

Shuhong Liu

Jinlin Wang

Jieping Zhang

Gopalakrishnan Subramanian

Larry DeCesare

Jason Murphy

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first package, wherein the first package comprises, a first package substrate, a first die over the first package substrate, a first mold layer over the first package substrate and around the first die, and a plurality of through mold interconnects (TMIs) through the first mold layer. The electronic package may further comprise a second package electrically coupled the first package by the TMIs, wherein the second package comprises a second package substrate, a second die over the second package substrate, and a solder resist over a surface of the second package substrate opposite from the second die. In an embodiment, the electronic package may also comprise a barrier between the first package and the second package.

Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.

Laser ablation-based surface property modification and contamination removal

Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone

Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone

A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.

Inline measurement of molding material thickness using terahertz reflectance

Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a die attach area, and forming a layer on the substrate outside of the die attach area. The layer may be formed from a fluoropolymer material. The method also includes coupling a die to the substrate in the die attach area, wherein a gap remains between the die and the die attach area. The method also includes placing an underfill material in the gap and adjacent to the layer on the substrate. Examples of fluoropolymer materials which may be used include polytetrafluoroethylene (PTFE) and perfluoroalkoxy polymer resin (PFA). Other embodiments are described and claimed.

Reducing underfill keep out zone on substrate used in electronic device processing

Methods and apparatus to control surface properties via colloidal coatings are described. In one embodiment, colloidal coating may be used on a surface to enhance flow control. Other embodiments are also described.

Controlling substrate surface properties via colloidal coatings

Growing community of inventors

Chandler, AZ, United States of America

Shripad Gokhale