IDiyas

For the Inventor, By the Inventor

Kanagawa, Japan

Shirou Murai

USPTO Granted Patents = 8

Average Co-Inventor Count = 4.3

ph-index = 4

Forward Citations = 46(Granted Patents)


Location History:

  • Toyama, JP (2000 - 2001)
  • Kanagawa, JP (2001 - 2004)

Company Filing History:

goldMedal8 out of 51 
 
Nippei Toyama Corporation
 patents

Years Active: 2000-2004

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8 patents (USPTO):
1. 6722956 - Working apparatus (2004-04-20),
2. 6439969 - Apparatus and method of chamfering wafer (2002-08-27),
3. 6332834 - Method and apparatus for grinding a workpiece (2001-12-25),
4. 6302769 - Method for chamfering a wafer (2001-10-16),
5. 6296553 - Grinding method, surface grinder, workpiece support, mechanism and work rest (2001-10-02),
6. 6220931 - Feeding a grinding wheel in grinding method (2001-04-24),
7. 6113489 - Ingot slicing method, an ingot manufacturing method and a sliced ingot (2000-09-05),
8. 6036585 - Grinder and grinding method (2000-03-14),

Title: The Innovations of Shirou Murai

Introduction

Shirou Murai is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of engineering, particularly in the development of advanced grinding apparatuses. With a total of eight patents to his name, Murai's work has had a considerable impact on the manufacturing processes of semiconductor materials.

Latest Patents

Murai's latest patents include a working apparatus that features a finishing grindstone member fixed to a spindle by a bolt. This spindle contains a tool mounting portion designed to accommodate both a rough grindstone member and a cover member. The cover member is utilized to prevent contamination of the tool mounting portion during the finish grinding of silicone wafers. Another significant patent involves an apparatus and method for chamfering wafers. This method allows for precise chamfering along the edges of notch grooves using a grindstone, which can be adjusted for diameter to maintain the desired shape and surface roughness.

Career Highlights

Murai is currently employed at Nippei Toyama Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and quality of wafer processing, which is crucial in the semiconductor industry.

Collaborations

Murai collaborates with talented coworkers, including Toyotaka Wada and Kenichiro Nishi. Their combined expertise contributes to the advancement of their projects and the overall success of their innovations.

Conclusion

Shirou Murai's contributions to the field of engineering and his innovative patents demonstrate his commitment to advancing technology in the semiconductor industry. His work continues to influence manufacturing processes and improve product quality.

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