Nippei Toyama Corporation

Shirou Murai

Toyotaka Wada

Kenichiro Nishi

Mitsuru Nukui

Kazuo Nakajima

Tetsuo Okuyama

Michihiro Takata

Muneaki Kaga

Tomoyuki Kawatsu

Kikuo Koma

Kunihiro Saita

Tomio Nakagawa

A finishing grindstone member ( ) is fixed to a spindle ( ) by a bolt. In the spindle ( ), there is formed a tool mounting portion ( ) into which a rough grindstone member can be mounted. Into the tool mounting portion ( ), there can be mounted not only the rough grindstone member but also a cover member ( ). After a silicone wafer is roughly ground using the rough grindstone member, when finish grinding the silicone wafer using the finishing grindstone member ( ), the cover member ( ) is mounted onto the tool mounting portion ( ) to thereby prevent the tool mounting portion ( ) from being soiled.

Working apparatus

Chamfering C1 is performed along the edge of a notch groove by the center of a grindstone . Change to grindstone center is performed to perform chamfering C along the edge of the notch groove. Similarly, chamfering C , C and C are formed. A grindstone having a large diameter can be employed. Only control of the diameter of the grindstone is required to maintain the shape. Satisfactory surface roughness can be realized. It is possible to improve surface roughness of a notch groove of a wafer and realize high efficiency.

Apparatus and method of chamfering wafer

A workpiece,formed of a circular thin plate is rotated about its center as an axis L,. Each of disk-shaped rotating grinding wheels,and,, while being rotated about an axis L,extending in a direction substantially parallel to the plane of the workpiece,and perpendicular to the radial direction of the workpiece,, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece,along an outer peripheral edge portion,of the workpiece,. Consequently, the outer peripheral edge portion,of the workpiece,is ground by an outer peripheral surface of each of the rotating grinding wheels,and,. In this case, it is preferred that two grinding wheels,and,for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

Method and apparatus for grinding a workpiece

In the wafer chamfering method, there is used a disk-shaped grindstone,which includes: a peripheral edge portion serving as a grinding surface,a flat portion formed in the central portion of the grinding surface,in the width direction thereof; and, two edge portions,respectively formed on the two sides of the flat portion,in the width direction thereof and made in the form of the shape of the valley portion of the notch portion,of a disk-shaped wafer,to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone,the grindstone,is revolved in the thickness direction of the wafer,to thereby chamfer the wafer,Especially, the present wafer chamfering method comprises two steps: that is, a circumferential portion grinding step in which the grindstone is supported such that it stands upright or at right angles to the circumferential portion,of the wafer,at their respective mutual contact points and only the flat portion of the grindstone,is contacted with the mutual contact points to thereby chamfer the peripheral edge portion of the wafer,and, a notch portion grinding step in which the grindstone is supported such that it is inclined with respect to the diameter direction of the notch portion of the wafer,by an angle of about 45&deg; in the circumferential direction of the wafer,and the edge portions,or both of the edge portions,and flat portion,are used to chamfer the notch portion,of the wafer

Method for chamfering a wafer

A workpiece receiving hole,for fittingly receiving a workpiece,is formed in the center of a rotary disk,which is thinner than the workpiece,. A workpiece drive section,which engages a notch,formed for the purpose of orienting the workpiece,relative to crystal orientation is formed along the brim of the hole,. A gear,is rotated by a gear,of a motor,, thereby rotating the rotary disk,and imparting torque to the workpiece,. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.

Grinding method, surface grinder, workpiece support, mechanism and work rest

A spindle,of a grinding wheel,is rotatively borne by a bench,for the grinding wheel through hydrostatic thrust bearings,and,. A pressure regulator,for regulating the pressure which must be supplied to at least either of supply ports,and,opposite to each other in the direction of the axial line of the spindle,in the hydrostatic thrust bearings,and,is provided. The pressure regulator,has a changing member for changing a passage for choking the fluid and the length of the choking passage.

Feeding a grinding wheel in grinding method

A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said slicing apparatus 4 are integrally superposed one on top another.

Ingot slicing method, an ingot manufacturing method and a sliced ingot

A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

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Kanagawa, Japan

Shirou Murai