The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Mar. 10, 2000
Applicant:
Inventors:
Kikuo Koma, Toyama, JP;
Shirou Murai, Kanagawa, JP;
Muneaki Kaga, Toyama, JP;
Michihiro Takata, Toyama, JP;
Assignee:
Nippei Toyama Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 ; B24B 7/00 ;
U.S. Cl.
CPC ...
B24B 1/00 ; B24B 7/00 ;
Abstract
Chamfering C1 is performed along the edge of a notch groove by the center of a grindstone . Change to grindstone center is performed to perform chamfering C along the edge of the notch groove. Similarly, chamfering C , C and C are formed. A grindstone having a large diameter can be employed. Only control of the diameter of the grindstone is required to maintain the shape. Satisfactory surface roughness can be realized. It is possible to improve surface roughness of a notch groove of a wafer and realize high efficiency.