Company Filing History:
Years Active: 2001-2002
Title: Muneaki Kaga: Innovator in Wafer Processing Technology
Introduction
Muneaki Kaga is a notable inventor based in Toyama, Japan. He has made significant contributions to the field of wafer processing technology, holding 2 patents that enhance the efficiency and quality of wafer production.
Latest Patents
Kaga's latest patents include an "Apparatus and method of chamfering wafer" and a "Method and apparatus for grinding a workpiece." The chamfering patent describes a process where chamfering is performed along the edge of a notch groove using a grindstone. This method allows for the use of a larger diameter grindstone, which can improve surface roughness and efficiency in wafer production. The grinding patent outlines a technique for grinding a circular thin plate workpiece, utilizing rotating grinding wheels to achieve both rough and finish grinding in a single station.
Career Highlights
Muneaki Kaga is associated with Nippei Toyama Corporation, where he applies his expertise in wafer processing. His innovative approaches have contributed to advancements in the manufacturing processes used in the semiconductor industry.
Collaborations
Kaga has worked alongside talented colleagues such as Shirou Murai and Michihiro Takata, contributing to a collaborative environment that fosters innovation and development in their field.
Conclusion
Muneaki Kaga's work in wafer processing technology exemplifies the impact of innovation on manufacturing efficiency and quality. His patents reflect a commitment to advancing the industry and improving production methods.