Nippei Toyama Corporation

Muneaki Kaga

Shirou Murai

Michihiro Takata

Mitsuru Nukui

Toyotaka Wada

Tetsuo Okuyama

Kikuo Koma

Chamfering C1 is performed along the edge of a notch groove by the center of a grindstone . Change to grindstone center is performed to perform chamfering C along the edge of the notch groove. Similarly, chamfering C , C and C are formed. A grindstone having a large diameter can be employed. Only control of the diameter of the grindstone is required to maintain the shape. Satisfactory surface roughness can be realized. It is possible to improve surface roughness of a notch groove of a wafer and realize high efficiency.

Apparatus and method of chamfering wafer

A workpiece,formed of a circular thin plate is rotated about its center as an axis L,. Each of disk-shaped rotating grinding wheels,and,, while being rotated about an axis L,extending in a direction substantially parallel to the plane of the workpiece,and perpendicular to the radial direction of the workpiece,, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece,along an outer peripheral edge portion,of the workpiece,. Consequently, the outer peripheral edge portion,of the workpiece,is ground by an outer peripheral surface of each of the rotating grinding wheels,and,. In this case, it is preferred that two grinding wheels,and,for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.

Method and apparatus for grinding a workpiece

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Toyama, Japan

Muneaki Kaga