The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2001
Filed:
Apr. 13, 1999
Kenichiro Nishi, Kanagawa, JP;
Shirou Murai, Toyama, JP;
Nippei Toyama Corporation, Tokyo, JP;
Abstract
In the wafer chamfering method, there is used a disk-shaped grindstone,which includes: a peripheral edge portion serving as a grinding surface,a flat portion formed in the central portion of the grinding surface,in the width direction thereof; and, two edge portions,respectively formed on the two sides of the flat portion,in the width direction thereof and made in the form of the shape of the valley portion of the notch portion,of a disk-shaped wafer,to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone,the grindstone,is revolved in the thickness direction of the wafer,to thereby chamfer the wafer,Especially, the present wafer chamfering method comprises two steps: that is, a circumferential portion grinding step in which the grindstone is supported such that it stands upright or at right angles to the circumferential portion,of the wafer,at their respective mutual contact points and only the flat portion of the grindstone,is contacted with the mutual contact points to thereby chamfer the peripheral edge portion of the wafer,and, a notch portion grinding step in which the grindstone is supported such that it is inclined with respect to the diameter direction of the notch portion of the wafer,by an angle of about 45° in the circumferential direction of the wafer,and the edge portions,or both of the edge portions,and flat portion,are used to chamfer the notch portion,of the wafer