Shiro Amagai

Title: Shiro Amagai: Innovator in Semiconductor Wafer Manufacturing

Introduction

Shiro Amagai is a notable inventor based in Nishigo-mura, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of double-side polishing methods. With a total of 3 patents to his name, Amagai's work has advanced the efficiency and quality of semiconductor wafers.

Latest Patents

Amagai's latest patents include a double-side polishing method and a double-side polishing apparatus. The double-side polishing method involves simultaneously polishing both surfaces of a semiconductor wafer while holding it in a carrier. This process interposes the wafer between an upper turntable and a lower turntable, each equipped with a polishing pad. The method ensures that the semiconductor wafer is polished under specific conditions, allowing for optimal results in terms of flatness and quality. Additionally, he has developed a method for manufacturing semiconductor wafers that includes slicing, chamfering, and double-side polishing, which helps maintain the flatness of the wafers.

Career Highlights

Shiro Amagai is currently employed at Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His innovative approaches have contributed to the company's reputation for high-quality semiconductor products. His expertise in double-side polishing techniques has positioned him as a key figure in the advancement of semiconductor manufacturing processes.

Collaborations

Amagai has collaborated with notable coworkers, including Yuki Tanaka and Yoshihiro Usami. Their combined efforts have further enhanced the development of innovative solutions in the semiconductor field.

Conclusion

Shiro Amagai's contributions to semiconductor wafer manufacturing through his innovative patents and collaborative efforts have made a significant impact on the industry. His work continues to influence the quality and efficiency of semiconductor production.