Hitachi, Japan

Shinji Shirakawa

This inventor holds 20 USPTO granted patents and 4 published patent applications and 2 EPO patents, primarily in Power Conversion Technology. Top assignees: Hitachi, Ltd., Tanaka Denshi Kogyo Kabushiki Kaisha. Active years: 1994-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Shirakawa. Retrieved from https://idiyas.com/inventor/shinji-shirakawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20 

% Patents Active = 60.0

 

Average Co-Inventor Count = 4.8

ph-index = 8

Forward Citations = 236(Granted Patents)


Location History:

  • Chiyoda-ku, JP (2007 - 2009)
  • Hitachi, JP (2002 - 2011)
  • Moriya, JP (2013)
  • Tokyo, JP (1994 - 2018)

Company Filing History:


Years Active: 1994-2018

Loading Chart...
Loading Chart...
Areas of Expertise:
Power Conversion
Semiconductor Device
Plasma Display
Electric Vehicle
Electric Power Generation
Motor Control
Bonding Wire
Integrated Circuit
MOS Rectifier
Driving System
Manufacturing Method
20 patents (USPTO):Explore Patents

Title: **Innovations by Inventor Shinji Shirakawa**

Introduction

Shinji Shirakawa, based in Tokyo, Japan, is a distinguished inventor credited with three patents primarily focused on advancements in semiconductor technology. His innovative work has made significant contributions to the field, enhancing the performance and reliability of semiconductor devices.

Latest Patents

Shinji Shirakawa's latest patents demonstrate his expertise in the development of bonding wires for semiconductor devices. The first notable patent is for a **palladium bonding wire**, which incorporates high purity palladium or palladium alloy as a base metal. This invention uniquely utilizes low boiling elements to improve the bonding process, ensuring enhanced solubility and mechanical strength.

His second recent patent is a **clad bonding wire** designed for electrically connecting the bonding pad of a semiconductor device to an external lead. This innovation features a dual-material structure where a core wire, composed of high-purity metals, is clad with another metal different from the core. This unique design allows for improved performance during the bonding process, significantly strengthening the connection.

Career Highlights

Shinji Shirakawa is currently employed at **Tanaka Denshi Kogyo Kabushiki Kaisha**, where he continues to push the boundaries of semiconductor technology. His insights and innovations have positioned the company as a leader in the industry, aligning with today’s technological demands.

Collaborations

Throughout his career, Shinji has worked alongside esteemed colleagues, including Katsuyuki Toyofuku and Ichiro Nagamatsu. Their collaboration has fostered a creative environment that breeds innovation, resulting in impactful advancements in semiconductor technology.

Conclusion

Shinji Shirakawa's contributions to the field of semiconductor technology reflect his dedication to quality and innovation. With a strong foundation in his patents and collaborations, he continues to inspire future advancements, making a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…