Semiconductor device having bridge-connected wiring structure

Abstract

The present invention provides a semiconductor device which reduces an inductance of wiring for bridge-connecting semiconductor switches and realizes a reduction in size. Within the semiconductor device formed are two controllable bridge-connected semiconductor switchesand, an output terminal, positive/negative polarity DC terminalsand, and an insulating substratein which conductor layersandhaving a conductor section and in an inner layer for bridge-connecting the semiconductor switches to the DC terminals on a surface thereof and insulating layersandare alternately laminated. The surface and inner-layer conductor layersandwhich interpose the insulating layertherebetween are electrically connected by a conductorpassing through the insulating layerinterposed between the conductor layersand. A current path (dotted line) is so provided as to allow current flowing through a bridge circuit for mounting the two semiconductor switches on the insulating substrate to flow in opposite directions between the conductor layersandwhich interpose the insulating layertherebetween.