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For the Inventor, By the Inventor

Tokyo, Japan

Shinji Ohuchi

This inventor holds 49 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Semiconductor Devices. Top assignees: Oki Electric Industry Co., Ltd., Oki Semiconductor Co., Ltd.. Active years: 1999-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shinji Ohuchi. Retrieved from https://idiyas.com/inventor/shinji-ohuchi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 49 

% Patents Active = 77.6


Average Co-Inventor Count = 2.0

ph-index = 16

Forward Citations = 897(Granted Patents)


Company Filing History:

goldMedal43 out of 4,980 
 
Oki Electric Industry Co., Ltd.
 patents
silverMedal6 out of 707 
 
Oki Semiconductor Co., Ltd.
 patents

Years Active: 1999-2013

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Areas of Expertise:
Semiconductor Device
Resin Molding
Device Packaging
Manufacturing Method
Sealing Resin
Stack Type Device
Solder Bumps
Bond Pad
Plastic Package
Insulating Tape
Posts with Bumps
Aggregate Type Device
49 patents (USPTO):Explore Patents
1. 8486728 - Semiconductor device including semiconductor elements mounted on base plate (2013-07-16),
2. 8008129 - Method of making semiconductor device packaged by sealing resin member (2011-08-30),
3. 7977229 - Method for fabricating resin-molded semiconductor device having posts with bumps (2011-07-12),
4. 7928546 - Semiconductor device and manufacturing method thereof (2011-04-19),
5. 7723832 - Semiconductor device including semiconductor elements mounted on base plate (2010-05-25),
6. 7704801 - Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device (2010-04-27),
7. 7592690 - Semiconductor device including semiconductor elements mounted on base plate (2009-09-22),
8. 7427810 - Semiconductor device including semiconductor element mounted on another semiconductor element (2008-09-23),
9. 7405138 - Manufacturing method of stack-type semiconductor device (2008-07-29),
10. 7314779 - Semiconductor device, manufacturing method for semiconductor device and mounting method for the same (2008-01-01),
11. 7307337 - Resin-molded semiconductor device having posts with bumps and method for fabricating the same (2007-12-11),
12. 7019397 - Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device (2006-03-28),
13. 6911722 - Resin-molded semiconductor device having posts with bumps (2005-06-28),
14. 6852564 - Semiconductor device and method of fabricating the same (2005-02-08),
15. 6750125 - Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby (2004-06-15),

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Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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