Shinji Ohuchi

This inventor holds 49 USPTO granted patents and 2 published patent applications and 1 EPO patent, primarily in Semiconductor Devices. Top assignees: Oki Electric Industry Co., Ltd., Oki Semiconductor Co., Ltd.. Active years: 1999-2013.

USPTO Granted Patents = 49 (Patent Applications = 2)

% Patents Active = 77.6

EPO Patents = 1

Average Co-Inventor Count = 2.0

ph-index = 16

Forward Citations = 897(Granted Patents)

Company Filing History:

43 out of 4,980

Oki Electric Industry Co., Ltd.

patents

6 out of 707

Oki Semiconductor Co., Ltd.

patents

Years Active: 1999-2013

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Areas of Expertise:

Semiconductor Device

Resin Molding

Device Packaging

Manufacturing Method

Sealing Resin

Stack Type Device

Solder Bumps

Bond Pad

Plastic Package

Insulating Tape

Posts with Bumps

Aggregate Type Device

49 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8486728 - Semiconductor device including semiconductor elements mounted on base plate (2013-07-16),

2. 8008129 - Method of making semiconductor device packaged by sealing resin member (2011-08-30),

3. 7977229 - Method for fabricating resin-molded semiconductor device having posts with bumps (2011-07-12),

4. 7928546 - Semiconductor device and manufacturing method thereof (2011-04-19),

5. 7723832 - Semiconductor device including semiconductor elements mounted on base plate (2010-05-25),

6. 7704801 - Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device (2010-04-27),

7. 7592690 - Semiconductor device including semiconductor elements mounted on base plate (2009-09-22),

8. 7427810 - Semiconductor device including semiconductor element mounted on another semiconductor element (2008-09-23),

9. 7405138 - Manufacturing method of stack-type semiconductor device (2008-07-29),

10. 7314779 - Semiconductor device, manufacturing method for semiconductor device and mounting method for the same (2008-01-01),

11. 7307337 - Resin-molded semiconductor device having posts with bumps and method for fabricating the same (2007-12-11),

12. 7019397 - Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device (2006-03-28),

13. 6911722 - Resin-molded semiconductor device having posts with bumps (2005-06-28),

14. 6852564 - Semiconductor device and method of fabricating the same (2005-02-08),

15. 6750125 - Semiconductor device and method for manufacturing the same, semiconductor wafer and semiconductor device manufactured thereby (2004-06-15),

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