Oki Electric Industry Co., Ltd.

Oki Semiconductor Co., Ltd.

Shinji Ohuchi

Yasushi Shiraishi

Yasuo Tanaka

Shigeru Yamada

Noritaka Anzai

Etsuo Yamada

Hiroshi Kawano

Yoshimi Egawa

Harufumi Kobayashi

Mitsuhiko Ogihara

Motoki Kobayashi

Makoto Terui

Morifumi Ohno

Hidekazu Nasu

A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate&#x2014;such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Semiconductor device including semiconductor elements mounted on base plate

A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Method of making semiconductor device packaged by sealing resin member

A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

Method for fabricating resin-molded semiconductor device having posts with bumps

With the objective of enabling a reduction in the size of a final semiconductor device and its thinning, and attaining facilitation of a manufacturing process, the semiconductor device includes a circuit chip having a flat mounted surface, a circuit chip smaller in size than the former circuit chip, and a sheet-like support. The latter circuit chip is formed over a substrate and has a flat back surface fixed to the substrate and a flat surface positioned on the side opposite to the back surface. The support is bonded to the surface of the latter circuit chip and supports the latter circuit chip. Then, the back surface of the latter circuit chip supported by the support is peeled from the substrate and pressed against the mounted surface, thereby fixing the back surface of the latter circuit chip and the mounted surface by an intermolecular bonding force (e.g., hydrogen bonding).

Semiconductor device and manufacturing method thereof

A resin sealed semiconductor device includes a semiconductor chip having a main surface, a plurality of surface electrodes formed on the main surface of the chip, a plurality of projection electrodes formed the main surface, each projection electrode being connected to respective one surface electrodes, and a resin shield covering the main surface, the surface electrodes and side surfaces of the projection electrodes, the resin having a thermal expansion coefficient in the range of 8-10 ppm/&#xb0; C. and a Young's modulus in the range of 1.8-2.0 Gpa.

Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device

A semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using solder joints.

A semiconductor device including a first semiconductor element mounted on a first surface of second semiconductor element, wherein solder balls are formed on the first surface of the second semiconductor element such that the first surface includes an area without solder balls. At least one first semiconductor element is mounted to the second semiconductor element at the area of the first surface without solder balls. The at least one first semiconductor element may be mounted to the second semiconductor element using solder joints.

Semiconductor device including semiconductor element mounted on another semiconductor element

A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part if wiringis formed al so at the side surface of a semiconducter element, and bump electrodesformed so as to be nearly on a same plane as the wiringformed at the side surface of the semiconducter element, at least a part of ball electrodesis formed so as to connect electrically to the wiringat the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring, and the confronting surface of the circuit forming surface is sealed with resin.

Manufacturing method of stack-type semiconductor device

A semiconductor device in accordance with the present invention reduces cracks occurring in a junction between a semiconductor device and a mounting substrate due to a heat stress when the semiconductor device is mounted on a printed circuit board or the like. The semiconductor device has a semiconductor element having a thickness of 200 &#x3bc;m or less, an electrode pad formed an the semiconductor element, a post electrically connected to the electrode pad, and a sealing resin for sealing a surface where circuitry is formed and the post. Furthermore, a manufacturing method for a semiconductor device in accordance with the present invention includes a step for forming an electrode pad on a main surface of a semiconductor wafer, a step for forming a post to be connected to the electrode pad, a step for resin-sealing the main surface of the semiconductor wafer and the post, a step for forming a groove from a surface of the resin to a predetermined depth of the semiconductor wafer, and a step for polishing a rear surface of the semiconductor wafer to a bottom of the groove and dividing the semiconductor wafer into individual semiconductor devices.

Semiconductor device, manufacturing method for semiconductor device and mounting method for the same

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part of wiringis formed at the side surface of a semiconductor element, and bump electrodesare formed so as to be nearly on a same plane as the wiringformed at the side surface of the semiconductor element. At least a part of ball electrodesis formed so as to connect electrically to the wiringat the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring, and the confronting surface of the circuit forming surface is sealed with resin.

Semiconductor device, manufacturing method of semiconductor device, stack type semiconductor device, and manufacturing method of stack type semiconductor device

Resin-molded semiconductor device having posts with bumps

A semiconductor device is disclosed which includes a semiconductor chip having a plurality of electrode pads on its upper surface; terminals such as copper posts formed on the upper surface of the semiconductor chip, and electrically connected to each of the electrode pads; a resin deposited on the upper surface of the semiconductor chip, encapsulating the terminals but exposing at least some of them to a predetermined height; and electroconductor members such as solder balls connected to the terminals. There is also disclosed a method of fabricating such a semiconductor device.

Semiconductor device and method of fabricating the same

A semiconductor device comprises a base semiconductor substrate ( ) having an edge area ( ) which surrounds an element forming area ( ), a buried oxide film ( ) provided over the base semiconductor substrate ( ) in the element forming area ( ), an element forming semiconductor substrate ( ) provided over the buried oxide film ( ).

Growing community of inventors

Tokyo, Japan

Shinji Ohuchi