The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2006
Filed:
May. 11, 2001
Shinji Ohuchi, Tokyo, JP;
Yasushi Shiraishi, Tokyo, JP;
Yasuo Tanaka, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part of wiringis formed at the side surface of a semiconductor element, and bump electrodesare formed so as to be nearly on a same plane as the wiringformed at the side surface of the semiconductor element. At least a part of ball electrodesis formed so as to connect electrically to the wiringat the side surface of the semiconductor element, the side surface of the semiconductor element is sealed with resin exposing the wiring, and the confronting surface of the circuit forming surface is sealed with resin.