Shing-Kuei Lai

Title: Shing-Kuei Lai: Innovator in Semiconductor Technology

Introduction

Shing-Kuei Lai is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to wafer alignment.

Latest Patents

One of his latest patents is a method for semiconductor wafer alignment. This method involves providing a semiconductor wafer with two alignment marks, which can be located on either the active region or the edge region of the wafer. The included angle formed between the two alignment marks in a circumferential direction is between about 12 degrees and about 36 degrees. The method also includes receiving a detection signal reflected from at least one of the alignment marks. A control system determines a parameter based on this detection signal, allowing for the movement of the semiconductor wafer according to the parameter. Another patent focuses on the semiconductor wafer itself, which includes a base layer with an active region and an edge region. This wafer features a number of semiconductor devices on the active region, a wafer identification on the edge region for identification purposes, and an alignment mark on the edge region for the alignment process.

Career Highlights

Shing-Kuei Lai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor manufacturing.

Collaborations

He has collaborated with notable coworkers, including Hsiao-Yi Wang and De-Fang Huang, contributing to various projects within the company.

Conclusion

Shing-Kuei Lai's innovative methods in semiconductor wafer alignment reflect his expertise and dedication to advancing technology in the semiconductor industry. His contributions continue to influence the field significantly.