Tokyo, Japan

Shin Takayama

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Shinkawa Ltd.. Active years: 2020-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shin Takayama. Retrieved from https://idiyas.com/inventor/shin-takayama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 3.4

ph-index = 1


Company Filing History:


Years Active: 2020-2022

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2 patents (USPTO):Explore Patents

Title: Innovations by Shin Takayama

Introduction

Shin Takayama is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is a pick-up device and pick-up method designed for picking up a semiconductor chip attached to a front surface of a sheet material. This device includes a stage that can transmit a destaticizing electromagnetic wave, which attracts and holds the rear surface of the sheet material. Additionally, it features a jacking-up pin that lifts the semiconductor chip from the rear side of the stage, along with a destaticizing mechanism that neutralizes charge generated between the semiconductor chip and the sheet material.

Another significant patent is an electronic component mounting apparatus, specifically a flip-chip bonding apparatus. This apparatus includes a bonding tool with a base and an island that vacuum-sucks a semiconductor die with protruding electrodes. It also incorporates a heater that heats the semiconductor die, bonds the protruding electrodes to another semiconductor die, and seals the gap between them using a non-conductive film. Continuous vacuum suction holes are strategically placed in the base to enhance functionality.

Career Highlights

Shin Takayama is currently employed at Shinkawa Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of electronic component assembly.

Collaborations

He collaborates with talented coworkers, including Yasuyuki Matsuno and Tomonori Nakamura, who contribute to the innovative projects at Shinkawa Ltd.

Conclusion

Shin Takayama's contributions to semiconductor technology through his patents reflect his dedication to innovation and excellence in his field. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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