The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2020
Filed:
Nov. 21, 2016
Shinkawa Ltd., Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A flip-chip bonding apparatus () is provided with: a bonding tool () that includes a base (), and an island () that vacuum-sucks, to a surface () thereof, a semiconductor die () having protruding electrodes () that are disposed on both the surfaces; and a heater () that heats the semiconductor die () vacuum-sucked to the island (). The flip-chip bonding apparatus heats the semiconductor die (), bonds the protruding electrodes () of the semiconductor die () to protruding electrodes () of a semiconductor die (), and seals, using a non-conductive film (NCF) (), a gap between the semiconductor die () and the semiconductor die (). Continuous vacuum suction holes () are provided in the base (), said continuously vacuum suction holes being at positions adjacent to the outer peripheral surface of the island ().