Company Filing History:
Years Active: 2020
Title: Midori Kobayashi: Innovator in Electronic Component Mounting Technology
Introduction
Midori Kobayashi is a prominent inventor based in Tokyo, Japan. She has made significant contributions to the field of electronic component mounting technology. Her innovative work has led to the development of a unique apparatus that enhances the efficiency of semiconductor bonding processes.
Latest Patents
Kobayashi holds a patent for an electronic component mounting apparatus. This flip-chip bonding apparatus features a bonding tool that includes a base and an island designed to vacuum-suck a semiconductor die with protruding electrodes. The apparatus also incorporates a heater that heats the semiconductor die while it is vacuum-sucked to the island. This technology allows for the bonding of the protruding electrodes of the semiconductor die to those of another semiconductor die, while sealing the gap between them using a non-conductive film. The design includes continuous vacuum suction holes in the base, strategically positioned adjacent to the outer peripheral surface of the island.
Career Highlights
Kobayashi's career is marked by her dedication to advancing semiconductor technology. Her innovative approach has positioned her as a key figure in her field. She works at Shinkawa Ltd., a company known for its cutting-edge technology in semiconductor manufacturing.
Collaborations
Throughout her career, Kobayashi has collaborated with notable colleagues, including Satoru Nagai and Shin Takayama. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Midori Kobayashi's contributions to electronic component mounting technology exemplify her commitment to innovation. Her patent for the flip-chip bonding apparatus showcases her ability to solve complex challenges in semiconductor manufacturing. Kobayashi continues to inspire future generations of inventors with her groundbreaking work.