The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 22, 2022

Filed:

Jan. 30, 2018
Applicant:

Shinkawa Ltd., Tokyo, JP;

Inventors:

Yasuyuki Matsuno, Tokyo, JP;

Tomonori Nakamura, Tokyo, JP;

Shin Takayama, Tokyo, JP;

Hiroshi Omata, Tokyo, JP;

Assignee:

SHINKAWA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05F 3/06 (2006.01); H01T 19/04 (2006.01); H05F 3/04 (2006.01); H01L 21/683 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6831 (2013.01); H01L 21/52 (2013.01); H01T 19/04 (2013.01); H05F 3/04 (2013.01); H05F 3/06 (2013.01); H01L 2224/83191 (2013.01); Y10T 156/1917 (2015.01);
Abstract

A pick-up devicefor picking up a semiconductor chipattached to a front surface of a sheet materialis provided with: a stagethat includes a material a part or the entirety of which is capable of transmitting a destaticizing electromagnetic wave having an ionization effect and that attracts and holds a rear surface of the sheet material; a jacking-up pinfor jacking up the semiconductor chipfrom the rear side of the stage; and a destaticizing mechanismthat destaticizes charge generated between the semiconductor chipand the sheet materialby irradiating the rear surface of the semiconductor chipwith the destaticizing electromagnetic wave that is made to pass through the sheet materialfrom the rear side of the stage


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