Shih-Ping Lin

Title: Shih-Ping Lin: Innovator in Chip Stack Structures

Introduction: Shih-Ping Lin is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of chip stack structures. His innovative work has led to the filing of a patent that showcases his expertise and creativity in this area.

Latest Patents: Shih-Ping Lin holds a patent for a "Chip stack structure with conductive plug and method for forming the same." This invention presents a chip stack structure that includes a first chip with a substrate and interconnect structure, bonded to a second chip. The second chip features its own interconnect structure and substrate, with an insulating layer surrounding it. A conductive plug penetrates through the insulating layer to connect with the second interconnect structure, enhancing the functionality and efficiency of chip designs.

Career Highlights: Shih-Ping Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to collaborate with other talented professionals and contribute to groundbreaking advancements in technology.

Collaborations: Among his colleagues are Chuei-Tang Wang and Tso-Jung Chang, who share a commitment to innovation in semiconductor technology. Their collaborative efforts have further propelled advancements in the field.

Conclusion: Shih-Ping Lin's contributions to chip stack structures exemplify the importance of innovation in the semiconductor industry. His patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key player in advancing technology.