Taiwan Semiconductor Manufacturing Comp. Ltd.

Shih-Ping Lin

Chen-Hua Douglas Yu

Chuei-Tang Wang

Chieh-Yen Chen

Jeng-Shien Hsieh

Chih-peng Lin

Tso-Jung Chang

A chip stack structure is provided. The chip stack structure includes a first chip including a first substrate and a first interconnect structure over the first substrate. The chip stack structure includes a second chip over and bonded to the first chip. The second chip has a second interconnect structure and a second substrate over the second interconnect structure. The chip stack structure includes an insulating layer over the second interconnect structure and surrounding the second substrate. The chip stack structure includes a conductive plug penetrating through the insulating layer to the second interconnect structure.

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Taichung, Taiwan

Shih-Ping Lin