The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jan. 06, 2023
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chuei-Tang Wang, Taichung, TW;
Tso-Jung Chang, Taoyuan, TW;
Shih-Ping Lin, Taichung, TW;
Jeng-Shien Hsieh, Kaohsiung, TW;
Chih-Peng Lin, Hsinchu County, TW;
Chieh-Yen Chen, Taipei, TW;
Chen-Hua Yu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chip stack structure is provided. The chip stack structure includes a first chip including a first substrate and a first interconnect structure over the first substrate. The chip stack structure includes a second chip over and bonded to the first chip. The second chip has a second interconnect structure and a second substrate over the second interconnect structure. The chip stack structure includes an insulating layer over the second interconnect structure and surrounding the second substrate. The chip stack structure includes a conductive plug penetrating through the insulating layer to the second interconnect structure.