Shih-Hsuan Hsu

Title: Shih-Hsuan Hsu: Innovator in Communication Interface Structures

Introduction

Shih-Hsuan Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of communication interface structures, showcasing his innovative spirit through his patented inventions.

Latest Patents

Hsu holds a patent for a "Communication interface structure and Die-to-Die package." This invention provides a communication interface structure that includes first bumps arranged in a first row-column configuration and second bumps arranged in a second row-column configuration. Conductive lines are disposed between the first and second bumps to connect them. Notably, the first bumps in neighboring rows are alternately shifted, and the second bumps are positioned under or over the first bumps, enhancing the overall functionality of the package.

Career Highlights

Throughout his career, Hsu has worked with prominent companies such as Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Hsu has collaborated with talented individuals, including Sheng-Fan Yang and Chih-Chiang Hung. These partnerships have fostered a creative environment that encourages innovation and the development of new ideas.

Conclusion

Shih-Hsuan Hsu's work in communication interface structures exemplifies the impact of innovative thinking in technology. His contributions continue to influence the industry and inspire future inventors.