The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Jul. 13, 2022
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Sheng-Fan Yang, Hsinchu, TW;
Chih-Chiang Hung, Hsinchu, TW;
Yuan-Hung Lin, Hsinchu, TW;
Shih-Hsuan Hsu, Hsinchu, TW;
Igor Elkanovich, Hsinchu, TW;
Global Unichip Corporation, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A communication interface structure and a Die-to-Die package are provided. The communication interface structure includes first bumps arranged in a first row-column configuration, second bumps arranged in a second row-column configuration, and conductive lines disposed between the first bumps and the second bumps to connect each of the first bumps to each of the second bumps. The first bumps in neighboring rows are alternately shifted with each other. The second bumps are disposed under or over the first bumps, wherein each of the second bumps in even rows is at a position shifted in a column direction from a center of each of the first bumps in the even rows, and each of the second bumps in odd rows is at a position between two of the second bumps in the even rows in the column direction.