Shih-Ching Lin

Title: Shih-Ching Lin: Innovator in Composite Materials

Introduction

Shih-Ching Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of composite materials, particularly in the development of copper clad laminates. His innovative work has implications for high-speed electronic devices.

Latest Patents

Shih-Ching Lin holds a patent for a composite and copper clad laminate made therefrom. This patent discloses composites that comprise copper foils with at least one smooth surface and an adhesive layer characterized by low dielectric constant (Dk) and low dissipation factor (Df) properties. The copper clad laminates produced from these composites can be laminated with flexible or rigid substrates that exhibit heat resistance and strong bonding strength. The printed circuit boards (PCBs) made from these materials demonstrate low insertion loss and can be utilized in various electrical devices that operate at high speeds of at least 1 Gbps or high frequency signals of at least 1 GHz.

Career Highlights

Shih-Ching Lin is currently employed at DuPont Electronics, Inc., where he continues to advance his research in composite materials. His work is pivotal in enhancing the performance of electronic components, making them more efficient and reliable.

Collaborations

Shih-Ching Lin collaborates with talented individuals in his field, including Yu-Cheng Chen and Mu-Huan Chi. These collaborations foster innovation and contribute to the development of cutting-edge technologies.

Conclusion

Shih-Ching Lin's contributions to the field of composite materials and his innovative patent demonstrate his commitment to advancing technology in electronics. His work at DuPont Electronics, Inc. continues to influence the industry positively.