The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2026
Filed:
Apr. 18, 2023
Applicant:
Dupont Electronics, Inc., Wilmington, DE (US);
Inventors:
Shih-Ching Lin, Hsinchu, TW;
Tung Lin Li, New Taipei City, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); B32B 15/02 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C23C 28/04 (2006.01); C23C 30/00 (2006.01); H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); B32B 15/02 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); C23C 28/00 (2013.01); C23C 28/02 (2013.01); C23C 28/023 (2013.01); C23C 28/025 (2013.01); C23C 28/04 (2013.01); C23C 28/042 (2013.01); C23C 28/30 (2013.01); C23C 28/32 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 28/3225 (2013.01); C23C 28/34 (2013.01); C23C 28/345 (2013.01); C23C 28/3455 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H05K 1/00 (2013.01); H05K 1/02 (2013.01); H05K 1/0237 (2013.01); H05K 1/0277 (2013.01); H05K 1/03 (2013.01); H05K 1/0326 (2013.01); H05K 1/11 (2013.01); H05K 3/022 (2013.01); H05K 3/382 (2013.01); B32B 2311/12 (2013.01); B32B 2379/08 (2013.01); B32B 2457/08 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0355 (2013.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01); Y10T 428/12493 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12583 (2015.01); Y10T 428/1259 (2015.01); Y10T 428/12597 (2015.01); Y10T 428/12604 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12993 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24959 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/26 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01); Y10T 428/27 (2015.01); Y10T 428/273 (2015.01);
Abstract
Disclosed are surface-treated copper foils having at least one treated surface that exhibit high conductivity and a set of surface properties. Also provided are flexible copper-clad laminates and printed circuits made therefrom. The present printed circuits exhibit low insertion loss and are suitable for use in high speed/high frequency applications.