This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Dupont Electronics, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Tung Lin Li and Flexible Circuit Innovation.
Introduction
Tung Lin Li is an inventor based in Taipei, Taiwan. His patent work concerns flexible copper-clad laminates and printed circuits designed for high-speed and high-frequency applications.
Latest Patents
Li is associated with 1 patent, titled “Flexible Copper-Clad Laminate and Printed Circuit Made Therefrom.” The invention describes surface-treated copper foils with high conductivity and specified surface properties, as well as flexible copper-clad laminates and printed circuits made using those foils. The resulting circuits are designed to provide low insertion loss.
Career Highlights
Li is associated with DuPont Electronics, Inc. His patent highlights work on materials and circuit structures intended to support signal performance in demanding electronic applications.
Collaborations
Li’s listed coworker is Shih-Ching Lin. Their association reflects collaborative work connected with flexible circuit materials and printed-circuit technology.
Conclusion
Tung Lin Li’s patent focuses on conductive, surface-treated copper foils and flexible printed circuits designed for high-speed and high-frequency use.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile