The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Mar. 01, 2024
Applicant:
Dupont Electronics, Inc., Wilmington, DE (US);
Inventors:
Shih-Ching Lin, Hsinchu, TW;
Ya-Mei Lin, Hsinchu, TW;
Assignee:
DUPONT ELECTRONICS, INC., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/48 (2006.01); C25D 3/38 (2006.01); C25D 5/04 (2006.01); H01M 4/66 (2006.01);
U.S. Cl.
CPC ...
C25D 5/48 (2013.01); C25D 3/38 (2013.01); C25D 5/04 (2013.01); H01M 4/661 (2013.01);
Abstract
The present invention discloses an ultrathin copper foil without a carrier, that has an area weight of about 45 g/mor less; a nominal thickness of about 5.0 μm or less; a tensile strength of about 40 Kgf/mmor more; and a loop stiffness of 2 mN or more. Also disclosed are methods for manufacturing the present ultrathin copper foils, surface-treated ultrathin copper foils and articles made therefrom.