This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Dupont Electronics, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ya-mei Lin and Advances in Ultrathin Copper Foil.
Introduction
Ya-mei Lin is an inventor associated with Hsinchu, Taiwan. Her patent work includes an ultrathin copper foil designed to combine low weight and thickness with mechanical strength and stiffness.
Latest Patents
Lin is associated with 1 patent, titled “Ultrathin Copper Foil, a Method for Manufacturing the Same, and an Article Made Therefrom.” The invention describes a carrier-free copper foil with an area weight of about 45 g/m² or less, a nominal thickness of about 5.0 μm or less, a tensile strength of about 40 kgf/mm² or more, and a loop stiffness of 2 mN or more. It also covers manufacturing methods, surface-treated versions of the foil, and articles made from it.
Career Highlights
Lin’s listed patent work is connected with Dupont Electronics, Inc. The invention focuses on producing exceptionally thin copper foil while retaining properties that can support its handling and use in manufactured articles.
Collaborations
Lin is listed alongside her coworker Shih-Ching Lin, who is a woman. Their shared association reflects a connection to the development or patent record for the ultrathin copper foil technology.
Conclusion
Ya-mei Lin’s patent highlights an approach to carrier-free ultrathin copper foil that balances reduced material weight and thickness with strength and stiffness.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile