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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11839024 B1

PDFFull Text
Date of Patent:
Dec. 05, 2023

Filed:

May. 21, 2021

Composite and copper clad laminate made therefrom

Applicant:

Dupont Electronics, Inc., Wilmington, DE (US);

Inventors:

Yu-Cheng Chen, Hsinchu, TW;

Mu-Huan Chi, Hsinchu, TW;

Shih-Ching Lin, Hsinchu, TW;

Wei-Guang Liu, Hsinchu, TW;

Assignee:

DUPONT ELECTRONICS, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 7/02 (2019.01); B32B 15/14 (2006.01); B32B 27/28 (2006.01); B32B 27/34 (2006.01); B32B 15/20 (2006.01); B32B 7/12 (2006.01); B32B 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0366 (2013.01); B32B 5/024 (2013.01); B32B 7/12 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); B32B 27/34 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2270/00 (2013.01); B32B 2307/20 (2013.01); B32B 2307/538 (2013.01); B32B 2307/714 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0338 (2013.01);
Abstract

Disclosed are composites comprising copper foils having at least one smooth surface and an adhesive layer with low Dk and Df properties. Also disclosed are copper clad laminates made by laminating the present composites with flexible or rigid substrates that exhibit heat resistance and good to excellent bonding strength. The PCBs made therefrom exhibit low insertion loss and may be assembled with other components to form various electrical devices utilizing high speed of at least 1 Gps or high frequency signals of at least 1 GHz.

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Chen, Yu-Cheng. (2023). Composite and copper clad laminate made therefrom (U.S. Patent No. 11839024). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11839024

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