This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Dupont Electronics, Inc.. Active years: 2023.
Company Filing History:
Years Active: 2023
Title: Innovations by Mu-Huan Chi in Composite Materials
Introduction
Mu-Huan Chi is an accomplished inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of composite materials, particularly in the development of copper clad laminates. His innovative work has implications for high-speed electronic devices.
Latest Patents
Mu-Huan Chi holds a patent for a composite and copper clad laminate made therefrom. This patent discloses composites that comprise copper foils with at least one smooth surface and an adhesive layer featuring low dielectric constant (Dk) and dissipation factor (Df) properties. The copper clad laminates produced from these composites can be laminated with flexible or rigid substrates that exhibit heat resistance and strong bonding strength. The printed circuit boards (PCBs) created from these materials demonstrate low insertion loss and can be assembled with other components to form various electrical devices that utilize high speeds of at least 1 Gbps or high frequency signals of at least 1 GHz.
Career Highlights
Mu-Huan Chi is currently employed at DuPont Electronics, Inc., where he continues to advance the field of electronic materials. His work focuses on enhancing the performance and reliability of electronic components through innovative material solutions.
Collaborations
Some of his notable coworkers include Yu-Cheng Chen and Shih-Ching Lin, who contribute to the collaborative efforts in research and development within the company.
Conclusion
Mu-Huan Chi's contributions to composite materials and copper clad laminates are paving the way for advancements in high-speed electronic devices. His innovative patents and work at DuPont Electronics, Inc. highlight the importance of material science in modern technology.