Wei-Guang Liu

Title: Innovations of Wei-Guang Liu in Composite Materials

Introduction

Wei-Guang Liu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of composite materials, particularly in the development of copper clad laminates. His work is essential for advancing technologies in high-speed electrical devices.

Latest Patents

Wei-Guang Liu holds a patent for a composite and copper clad laminate made therefrom. This patent discloses composites that comprise copper foils with at least one smooth surface and an adhesive layer featuring low Dk and Df properties. The copper clad laminates produced from these composites can be laminated with flexible or rigid substrates that exhibit heat resistance and excellent bonding strength. The printed circuit boards (PCBs) made from these materials demonstrate low insertion loss and can be assembled with other components to create various electrical devices that utilize high speeds of at least 1 Gbps or high-frequency signals of at least 1 GHz.

Career Highlights

Wei-Guang Liu is currently employed at DuPont Electronics, Inc., where he continues to innovate in the field of electronics and materials science. His expertise in composite materials has positioned him as a key player in the development of advanced electronic components.

Collaborations

Some of his coworkers include Yu-Cheng Chen and Mu-Huan Chi, who collaborate with him on various projects within the company.

Conclusion

Wei-Guang Liu's contributions to composite materials and copper clad laminates are paving the way for advancements in high-speed electronic devices. His innovative work continues to impact the field significantly.