Shigeru Danjo

Title: Shigeru Danjo: Innovator in Semiconductor Manufacturing

Introduction

Shigeru Danjo is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 4 patents. His innovative methods have improved the efficiency and effectiveness of semiconductor chip production.

Latest Patents

Danjo's latest patents include a method for manufacturing semiconductor chips and an IC chip manufacturing method. The first patent describes a process where a semiconductor wafer is split into individual chips while minimizing damage. By using an adhesive sheet that can be stimulated to lower its adhesive force, the wafer is securely adhered to a support plate, allowing for precise grinding and dicing of the chips. The second patent focuses on an IC chip manufacturing method that enhances the handling of extremely thin wafers, ensuring they can be processed without damage. This method involves securing the wafer to a support plate with a specialized support tape and includes steps for polishing, adhering a dicing tape, and removing the support tape through stimulation.

Career Highlights

Throughout his career, Shigeru Danjo has worked with notable companies such as Sekisui Chemical Co., Ltd. and Disco Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Danjo has collaborated with several professionals in his field, including Akihiko Nishimoto and Katsura Hayashi. These collaborations have likely fostered advancements in semiconductor manufacturing techniques.

Conclusion

Shigeru Danjo's contributions to semiconductor manufacturing through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the industry and improve manufacturing processes.