The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2008
Filed:
Apr. 09, 2003
Masateru Fukuoka, Osaka, JP;
Munehiro Hatai, Osaka, JP;
Satoshi Hayashi, Osaka, JP;
Yasuhiko Oyama, Osaka, JP;
Shigeru Danjo, Osaka, JP;
Masahiko Kitamura, Tokyo, JP;
Koichi Yajima, Tokyo, JP;
Masateru Fukuoka, Osaka, JP;
Munehiro Hatai, Osaka, JP;
Satoshi Hayashi, Osaka, JP;
Yasuhiko Oyama, Osaka, JP;
Shigeru Danjo, Osaka, JP;
Masahiko Kitamura, Tokyo, JP;
Koichi Yajima, Tokyo, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Disco Corporation, Tokyo, JP;
Abstract
A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (), the front side of the semiconductor wafer (W) is adhered to the support plate (), thereby exposing the rear face () of the semiconductor wafer (W). The rear face () of the semiconductor wafer (W) with the support plate () is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face () up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.