Yasuhiko Oyama

Title: Yasuhiko Oyama: Innovator in Semiconductor Manufacturing

Introduction

Yasuhiko Oyama is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 2 patents. His innovative methods have improved the efficiency and safety of semiconductor chip production.

Latest Patents

Yasuhiko Oyama's latest patents include a method for manufacturing semiconductor chips and an IC chip manufacturing method. The first patent describes a process where a semiconductor wafer is split into individual chips while minimizing damage. By using an adhesive sheet that reduces its adhesive force upon stimulation, the wafer is securely adhered to a support plate, allowing for safe grinding and dicing of the chips. The second patent focuses on a method for manufacturing IC chips, which enhances the handling of extremely thin wafers, approximately 50 micrometers thick. This method involves securing the wafer to a support plate with a specialized support tape, polishing the wafer, and then dicing it while ensuring the wafer remains undamaged throughout the process.

Career Highlights

Throughout his career, Yasuhiko Oyama has worked with notable companies such as Sekisui Chemical Co., Ltd. and Disco Corporation. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Yasuhiko has collaborated with several professionals in his field, including Masateru Fukuoka and Munehiro Hatai. These collaborations have furthered advancements in semiconductor manufacturing techniques.

Conclusion

Yasuhiko Oyama's contributions to semiconductor manufacturing through his innovative patents and collaborations highlight his importance in the field. His work continues to influence the industry and improve manufacturing processes.