The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2005
Filed:
Jan. 15, 2003
Masateru Fukuoka, Mishima-gun, JP;
Yasuhiko Oyama, Osaka, JP;
Munehiro Hatai, Mishima-gun, JP;
Satoshi Hayashi, Mishima-gun, JP;
Shigeru Danjo, Mishima-gun, JP;
Masahiko Kitamura, Ota-ku, JP;
Koichi Yajima, Ota-ku, JP;
Masateru Fukuoka, Mishima-gun, JP;
Yasuhiko Oyama, Osaka, JP;
Munehiro Hatai, Mishima-gun, JP;
Satoshi Hayashi, Mishima-gun, JP;
Shigeru Danjo, Mishima-gun, JP;
Masahiko Kitamura, Ota-ku, JP;
Koichi Yajima, Ota-ku, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Disco Corporation, Tokyo, JP;
Abstract
It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 μm. The invention provides a method for manufacturing an IC chip comprising, at least: the step of securing a wafer to a support plate via a support tape having a surface layer comprising an adhesive (A) containing a gas generating agent for generating a gas due to stimulation and a surface layer comprising an adhesive (B); the step of polishing said wafer with securing said wafer to said support plate via said support tape; the step of adhering a dicing tape to said polished wafer; the step of providing said stimulation to said adhesive (A) layer; the step of removing said support tape from said wafer; and the step of dicing said wafer, which comprises adhering said surface layer comprising adhesive (A) to said wafer and adhering said surface layer comprising adhesive (B) to said support plate in the step of securing said wafer to said support plate via said support tape, providing said stimulation while uniformly sucking under reduced pressure the entirety of said wafer from the dicing tape side thereof, and then removing said support tape from said wafer in the step of providing stimulation to said adhesive (A) layer and in the step of removing said support tape from said wafer.