Shigemitsu Kunikane

Title: Shigemitsu Kunikane: Innovator in Wiring Substrate Technology

Introduction

Shigemitsu Kunikane is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring substrate technology, holding a total of 2 patents. His work focuses on the development of advanced wiring substrates that enhance the performance and reliability of electronic devices.

Latest Patents

Kunikane's latest patents include innovative designs for wiring substrates. One patent describes a wiring substrate that features a multilayer core substrate, which consists of core layers, core conductor layers, and core insulating layers. This design incorporates a first laminate on one surface and a second laminate on the opposite surface, both containing insulating and conductor layers. The multilayer core substrate is equipped with through-hole conductors and via conductors that connect the outermost core conductor layers on both surfaces. The core layer is designed to be thicker than the core insulating layers, ensuring optimal performance.

Another patent focuses on a wiring substrate that includes a substrate with conductor layers and core insulating layers. This design features a laminate with insulating and conductor layers, where the conductor layers include a first layer with a specific line pattern. The laminate also contains a pair of interlayer insulating layers and a pair of conductor layers that sandwich these layers. The substrate is designed to have a second strip line with a thicker pattern compared to the first, enhancing the overall functionality of the wiring substrate.

Career Highlights

Shigemitsu Kunikane is currently employed at Ibiden Company Limited, where he continues to innovate in the field of wiring substrates. His work has been instrumental in advancing the technology used in electronic devices, contributing to the efficiency and effectiveness of modern electronics.

Collaborations

Kunikane collaborates with Tomoyuki Ikeda, a fellow innovator in the field. Their partnership has led to the development of cutting-edge technologies that push the boundaries of wiring substrate applications.

Conclusion

Shigemitsu Kunikane is a prominent figure in the realm of wiring substrate technology, with a focus on creating innovative solutions that enhance electronic device performance. His contributions through patents and collaborations continue to shape the future of this critical field.